Podrobnosti návrhu
| Název | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-501: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of solder fluxes |
|---|---|
| Číslo | 91/2128/CDV - IEC 61189-5-501 ED2 |
| Zdroj | ISO\IEC\CEN\CENELEC |
| Komise | IEC/TC 91 (Electronics assembly technology) |
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| K připomínkám do | |
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Akce
Anotace
This part of IEC 61189 is used to quantify the deleterious effects of flux residues on surface insulation resistance (SIR) in the presence of moisture.
NOTE This test method can be used for detection of the effects of other residues or contaminations, but in this case test conditions, criteria and failure modes might be different.
Specifically, this method is designed to simultaneously assess:
– leakage current caused by ionized water films and electrochemical degradation of test vehicle, (corrosion, dendritic growth);
– provide metrics that can appropriately be used for binary classification (e.g. go/no go; pass/fail);
– compare, rank or characterize materials and processes.
The electrodes are electrically biased during conditioning to facilitate electrochemical reactions, as shown in Figure 1 and Figure 3.
This test is carried out at high humidity and heat conditions.
Instrukce
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